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International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship

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$7,000

deadline Due: February 15, 2026
pencil No essay
graduates No min. GPA required
map No transcripts required

Eligibility

International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship, with an application deadline in February, offers numerous awards of $7000 each.

Description

Each year, TAPPI is proud to offer multiple scholarship opportunities to graduate and undergraduate students in the pulp, paper, packaging and related industries. The Daniel Siegel Memorial Scholarship is funded by an endowment from MICA Corporation and the Siegel family. Applicants must demonstrate an interest in the technological areas covered by the International Flexible Packaging and Extrusion Division. Please visit the scholarship's website for more information.